Lapping A64 IHS and MSI K8N Neo2 Platinum Chipset (DONE, upto 16c Lower) *56k beware*

[javascripterror]

Or perhaps enlist the OCAU community in a survey of the IHS particularly where excessively high CPU temps are observed at idle.

[ridewitme]

Maybe the thermal pad that is used on the bottom of the Stock HSF's might be to help the slight discression in the concave IHS's, since I would imagine that the faulty ones would be margin of error.

[aresaid]

Mass manufacturing techniques can be very good or very bad.
Required tolerances need to be met. If not met, the product is deemed unacceptable.
Cost increases dramatically as zero tolerance (not a real thing, there are always imperfections) is approached.
AMD does not want to spend $100 per CPU making sure the IHS is flat. If the IHS passes heat tolerance tests, why would they spend more than necessary to achieve this?
Regards, Anthony Hunt

[petfoodonly]

I was just thinking a couple of things.

Firstly not every IHS would be 'heat tested'. That in itself would be very costly.

Secondly, it's probable that AMD and INTEL don't make their own IHSs, they would get someone else to do it. So it likly that the same company/factory makes IHSs for both AMD and INTEL. Thus the exact same problem for both CPU brands. No evidence for that, just an idea.

[Audiobuzz]

Originally Posted by MR CHILLED

I just question the results after seeing lapping results over the years, and I'm talking direct cpu lapping, not IHS lapping which would presumably yeild less of a result than cpu lapping.

Again, I don't disbeleive his individual results.

I disagree! If the points of contact on a concave IHS are the outer edges then the heat has further to travel and therefore a higher degrees/watt rating. If you then lap the IHS flat you bring the contact points much closer to the heat source. Doing this on a much smaller core (ie without an IHS) will produce less results as the points of contact are already closer to the heat source.

AB