New C3 in servers

leperMessiah · 31st July 2001, 9:48 AM

From VIA today:

NEXCOM builds High Density Blade Servers around Low Power VIA C3™ Processor and VIA Apollo Pro266 Chipset Platform.

Revolutionary NEXCOM HiServers employ cool processing VIA C3 processor and low voltage DDR memory to provide a combination of high performance and power efficiency in ultra dense computing environments.

Taipei, Taiwan, 30th July 2001 - VIA Technologies, Inc today announced that NEXCOM, the leading supplier of Industrial PC solutions, is to use the VIA C3™ processor and VIA Apollo Pro266 chipset platform to power its new series of HiServer high density blade servers.

The NEXCOM HiServer addresses the burgeoning demand for scalable, powerful, and easy to maintain server solutions for Corporate Data Centres, Web Hosting operations, and other high intensity computing and storage facilities. By using the VIA C3™ processor at speeds of up to 800MHz and the VIA Apollo Pro266 chipset platform with up to 4.0GB of ultra fast DDR memory, the HiServer can provide the performance and stability required to run the most demanding mission critical applications, while optimizing power efficiency and producing the minimum amount of heat.

In the ultra dense computing environment of the HiServer, with its highly integrated design that can stack tens or even hundreds of servers in one 19" rack, the cool processing features of the VIA C3™ processor based system can make a significant difference to reliability and energy costs. NEXCOM reports that HiServer employing the VIA C3™ processor up to speeds of 800MHz can lower system power consumption to less than 30 watts per blade server.

"There are some high density servers built with the Transmeta's Crusoe CPU." said Ted Yang, President NEXCOM USA. "However, these servers are only for the entry-level. We looked for a Socket 370 CPU that could offer the flexibility to migrate to higher speeds while maintaining low heat dissipation and power efficient properties. The VIA C3™ processor was a natural choice. Combined with the VIA Apollo Pro266 chipset, we are confident we have a scalable and high performance platform that will prove a success in the marketplace"

seaQuest_AMD · 31st July 2001, 10:48 AM

Yay! A server when the name "Intel" isnt on the front of the box!!!

31st July 2001, 9:48 AM	#1
leperMessiah Member Join Date: Jun 2001 Location: Sydney Posts: 1,242	New C3 in servers From VIA today: NEXCOM builds High Density Blade Servers around Low Power VIA C3™ Processor and VIA Apollo Pro266 Chipset Platform. Revolutionary NEXCOM HiServers employ cool processing VIA C3 processor and low voltage DDR memory to provide a combination of high performance and power efficiency in ultra dense computing environments. Taipei, Taiwan, 30th July 2001 - VIA Technologies, Inc today announced that NEXCOM, the leading supplier of Industrial PC solutions, is to use the VIA C3™ processor and VIA Apollo Pro266 chipset platform to power its new series of HiServer high density blade servers. The NEXCOM HiServer addresses the burgeoning demand for scalable, powerful, and easy to maintain server solutions for Corporate Data Centres, Web Hosting operations, and other high intensity computing and storage facilities. By using the VIA C3™ processor at speeds of up to 800MHz and the VIA Apollo Pro266 chipset platform with up to 4.0GB of ultra fast DDR memory, the HiServer can provide the performance and stability required to run the most demanding mission critical applications, while optimizing power efficiency and producing the minimum amount of heat. In the ultra dense computing environment of the HiServer, with its highly integrated design that can stack tens or even hundreds of servers in one 19" rack, the cool processing features of the VIA C3™ processor based system can make a significant difference to reliability and energy costs. NEXCOM reports that HiServer employing the VIA C3™ processor up to speeds of 800MHz can lower system power consumption to less than 30 watts per blade server. "There are some high density servers built with the Transmeta's Crusoe CPU." said Ted Yang, President NEXCOM USA. "However, these servers are only for the entry-level. We looked for a Socket 370 CPU that could offer the flexibility to migrate to higher speeds while maintaining low heat dissipation and power efficient properties. The VIA C3™ processor was a natural choice. Combined with the VIA Apollo Pro266 chipset, we are confident we have a scalable and high performance platform that will prove a success in the marketplace"

31st July 2001, 10:48 AM	#2
seaQuest_AMD Member Join Date: Jun 2001 Location: Wollongong Posts: 1,233	Yay! A server when the name "Intel" isnt on the front of the box!!! __________________ Awesome...awesome to the max.