AMD's 2012 lines: Komodo, Trinity, and, Krishna/Wichita

[stmok]

From Digitimes...
=> http://www.digitimes.com/news/a20110707PD211.html

Meanwhile, AMD will follow its original schedule and enter the 28nm era in the first half of 2012. The company's next-generation graphics chips Southern Island as well as Krishna and Wichita processors, which will replace the existing Ontraio and Zacate processors, and will all adopt a 28nm process from TSMC.

Well, that confirms what is made where...
* GlobalFoundries is responsible for A-series mainstream APU and FX-series CPU production.
* TSMC handles Bobcat-based APU and AMD GPU production.

The former is doing 32nm SOI, while the latter is currently on 40nm and moving to 28nm.

[Apokalipse]

Wasn't GF doing a 28nm bulk process? what will they use it for?

[stmok]

Originally Posted by Apokalipse

Wasn't GF doing a 28nm bulk process? what will they use it for?

From what I gather...

GlobalFoundries do their 45nm and 32nm process at Dresden in Germany. That facility is called Fab 1. Fab 1 consists of Modules 1 and 2. They used to be called Fab 36 and 38.
* Module 1 currently does 45nm and 32nm SOI processors. (Phenom II, Athlon II, Bulldozer, and Llano.)
* Module 2 is in a transition (200mm wafers to 300mm wafers). They will do 32nm and 28nm bulk in the future.

The primary site for 28nm bulk production will be at the new facility in New York, USA; called Fab 8. Its currently under construction. It'll produce 300mm wafers.

Fab 8 will consist of three Modules:
* Module 1 is scheduled to receive its 28nm production tools this month and will spend approx a year in running through quality checks. The goal is to start production in 2nd half of 2012 and push to full production capacity by 2014.
* Module 2 and 3 are reserved for future expansion of the whole facility.

Fab 8 engineers are also working with nearby partners (IBM and Albany Nanotech) for future 20nm and 14nm manufacturing process.

I have no idea what the 28nm bulk will be used for.

GlobalFoundries also have other clients aside from AMD; like Broadcom, Qualcomm, and STMicroelectronics.

[stmok]

Regarding GlobalFoundries fabrication capacities...These slides may help in giving you an overall picture.

The following are from http://www.inpai.com.cn/doc/hard/149843_4.htm



Fab 36 and Fab 38 are now Fab 1's Module 1 and 2. While NY is now called Fab 8. You can see they are on schedule with Fab 8.

...Come to think of it, Fab 8 and their Accelerated Parallel Processing (APP) SDK = OpenCL toolkit for their GPUs; are the only things that seem to be released or running as scheduled.



You might take the above chart with a grain of salt, as its created by a third-party site in Japan and seems a little off compared to the info that's being officially released by GlobalFoundries. Use it as an approx guide to get an idea.

There is no Fab 4 because of tetraphobia. ie: In Chinese, the pronunciation of 4 is almost the same as Death. (The difference is in tone.)

[stmok]

GlobalFoundries prepares Tri-Gate competitor
=> http://www.bit-tech.net/news/hardwar...e-competitor/1

No resting for Intel's competitors.

Tri-gate competitor => About a year (or so) behind Intel.
28nm? => Still use gate-first method.
20nm? => Follows Intel and TSMC with gate-last method. Aimed for 2013.
14nm? => "Well underway".

[stmok]

Be advised:
New slide leaked from Chinese source. This is an NDA one released this month ...See first and 2nd posts of this thread for revised info.

Overall summary (If you're too lazy to look back.)
* 2nd generation Bulldozer cores is codenamed Piledriver.
* Both Komodo and Trinity will use Socket FM2 and have Turbo CORE 3.0
* Trinity will re-use the chipset as found in the current A-series (Llano). ie: A75 and A55.
* Trinity goes up to 4 cores.
* Komodo will also be accompanied by a new chipset that will support USB 3.0 natively. Codenamed Hudson D4.
* Komodo goes up to 10 cores.


One thing we aren't too sure is the DDR3 memory configuration the desktop Piledriver-based processors will be using...I have suspicions that it will be using triple-channel like the Opteron oriented Sepang. (Which also goes up to 10 cores.)


Regardless, its safe to say if you buy into AMD's 2011 lines, you will have no upgrade path to their 2012 lines. ie: New mobo and CPU for your next upgrade...Those with a "future proof" oriented thinking will need to bare this in mind.

[Ice009]

Originally Posted by stmok

Be advised:
Overall summary (If you're too lazy to look back.)
* 2nd generation Bulldozer cores is codenamed Piledriver.
* Both Komodo and Trinity will use Socket FM2 and have Turbo CORE 3.0
* Trinity will re-use the chipset as found in the current A-series (Llano). ie: A75 and A55.
* Trinity goes up to 4 cores.
* Komodo will also be accompanied by a new chipset that will support USB 3.0 natively. Codenamed Hudson D4.
* Komodo goes up to 10 cores.


Regardless, its safe to say if you buy into AMD's 2011 lines, you will have no upgrade path to their 2012 lines. ie: New mobo and CPU for your next upgrade...Those with a "future proof" oriented thinking will need to bare this in mind.

So the new socket is FM2, like a few people speculated in the other thread. When is Komodo scheduled to be released? 1st half of next year or later?

[IMtech]

Originally Posted by Ice009

So the new socket is FM2, like a few people speculated in the other thread. When is Komodo scheduled to be released? 1st half of next year or later?

Quite interested in this too!

[Mikio]

Originally Posted by stmok

Regardless, its safe to say if you buy into AMD's 2011 lines, you will have no upgrade path to their 2012 lines. ie: New mobo and CPU for your next upgrade...Those with a "future proof" oriented thinking will need to bare this in mind.

exactly why I chose to go SB for now, can have a fiddle and move on to the new FM2 platform when its all a complete lineup and refined

[Ice009]

Originally Posted by Mikio

exactly why I chose to go SB for now, can have a fiddle and move on to the new FM2 platform when its all a complete lineup and refined

Probably the smart way to go, unless Bulldozer is way better than expected.

[Bertross]

ah crap so my UD5 is rendered useless?

[jinny1]

Originally Posted by Ice009

So the new socket is FM2, like a few people speculated in the other thread. When is Komodo scheduled to be released? 1st half of next year or later?

Most likely 2H,2012.

There would be outrage amongst users if AMD updated their line so quickly

[stmok]

Originally Posted by Ice009

So the new socket is FM2, like a few people speculated in the other thread. When is Komodo scheduled to be released? 1st half of next year or later?

Q3-ish of 2012. Approx 1 year or so after initial release.

Originally Posted by Mikio

exactly why I chose to go SB for now, can have a fiddle and move on to the new FM2 platform when its all a complete lineup and refined

Depending on the chipset and your mobo brand manufacturer, you can also upgrade to Ivy Bridge in 2012. (Both Sandy and Ivy Bridge use LGA1155, as Intel has made no major changes to cause incompatibility. BIOS update is needed though.) ...You only lose out on 7-series chipset features if you re-use a mobo from 2011.

This time around (2011 and 2012); Intel has the upgrade path.

Originally Posted by Bertross

ah crap so my UD5 is rendered useless?

...Only if you initially had plans to go with "Piledriver" based processors. (Its not possible to keep providing an upgrade path forever.)

2011 lines (AM3+ and FM1) aren't intended to be "future proof". The goal is to introduce the APU idea and Bulldozer architecture to the market.

2012 lines (FM2) is about refinement. So expect this to last to 2013 or so.

As time goes by, you'll eventually realise the whole future proofing idea is a waste of time and mental energy to worry over...Go with your needs.

=> Buy when you need it.
=> Use it up until it no longer fulfills your needs.
=> Sell (or give away) the old one.
=> Buy new one.
...Repeat cycle.

[Bertross]

i just wanted to try the AMD 8150 cpu.

[stmok]

Be advised:
New slides leaked for 2nd generation Bobcat platform => "Deccan". See bottom of the first post for slides.

Overview (For the lazy.)
* Die-shrink: 40nm to 28nm.
* DDR3 memory speed goes up from 1333Mhz to 1600Mhz.
* Low wattage DDR3 support has been added.
* More cores: Up to 4 cores.
* x86 cores improved: "up to" 20% better than Ontario (Current C-series APU).
* IGP is improved: 25% better than Ontario.
* Turbo mode with C6 power state support: Dynamically adjust CPU and IGP depending on the workload.
* TDPs:
=> 9W on C-series => 8W in Deccan (Low power versions).
=> 18W on E-series => 20W in Deccan.
* Secure Asset Management Unit (SAMU) added.
=> DRM in Blu-ray, etc eats into CPU load as you need to decrypt the content to view it. AMD has added SAMU (additional circuitry in UVD3) to take the load off the CPU. Which means longer battery life and lower power consumption under this scenario.