AMD's 2012 lines: Komodo, Trinity, and, Krishna/Wichita

Discussion in 'AMD x86 CPUs and chipsets' started by stmok, Jun 16, 2011.

  1. stmok

    stmok Member

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    This thread is based on what AMD has officially released and third-party leaks of slides. The point is to provide a summary or overview as to what is going on for 2012.

    I'll throw various charts in this post. In the next post, I'll try to summarise the information in a more useful (logical) form.


    The official AMD slides that were from their CES 2011 presentation back in January...They give you a good overview of what's going on.

    Desktops

    *Waiting for revised roadmaps*

    Notebooks

    *Waiting for revised roadmaps*



    Charts from other sources
    The following are slides from various presentations posted by third-party websites.

    From http://www.bit-tech.net/hardware/cpus/2011/06/14/amd-reveals-2012-roadmap/1
    From http://www.donanimhaber.com/islemci...yeni-nesil-Fusion-platformlari-detaylandi.htm
    From http://www.xbitlabs.com/news/cpu/di...Be_at_Least_50_Faster_than_Llano_Company.html
    From http://www.xbitlabs.com/news/cpu/di...lease_Twenty_Core_Microprocessor_in_2012.html
    From http://www.brightsideofnews.com/pri...k-tock-mode3b-schedules-20nm2c-14nm-apus.aspx
    From http://www.hardware.fr/news/11647/afds-50-trinity-10-tflops-2020.html

    AMD Codename Decoder
    http://blogs.amd.com/work/fadcodenames/
    (And official explanation from AMD.)

    From http://www.anandtech.com/show/4444/amd-llano-notebook-review-a-series-fusion-apu-a8-3500m
    From http://www.donanimhaber.com/islemci...-odakli-Hondo-islemci-ailesinin-detaylari.htm
    From http://mb.zol.com.cn/240/2405453.html
    From http://www.donanimhaber.com/islemci...-28nm-islemcileri-hakkinda-resmi-detaylar.htm
    From http://www.fudzilla.com/graphics/item/23895-28nm-graphics-dubbed-radeon-hd-7000-official
    From http://prohardver.hu/hir/amd_hosszutavu_mobil_utiterv.html and
    http://www.xtremehardware.it/news/h...-nel-2013-per-il-mercato-mobile-201109215761/
    From http://www.donanimhaber.com/islemci...esil-Bulldozer-mimarisi-icin-ilk-detaylar.htm
    From http://www.donanimhaber.com/islemci...-nesil-Fusion-islemci-ailesinin-detaylari.htm
     
    Last edited: Nov 7, 2011
  2. stmok

    stmok Member

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    * DRAFT * => This is based on what we know so far. Its obviously subject to change as new information becomes available.


    In 2012, AMD will field two main architectures for all their markets. These will be revised versions of Bulldozer and Bobcat. To avoid confusion, we'll call them Piledriver (2nd gen Bulldozer) and 2nd gen Bobcat.

    Desktop

    Small Form Factor (Deccan platform)
    * Codename: Wichita
    * Architecture: 2nd gen Bobcat (Up to 20% better against Ontario)
    * Up to 4 cores
    * Integrated Graphics: Budget DirectX 11 class GPU (25% better against Ontario)
    * DDR3-1600
    * Replaces E-series Fusion APUs (Zacate).

    Budget (aka: Value or Essential) and Mainstream (Virgo platform)
    * Codename: Trinity
    * Architecture: Piledriver
    * Up to 4 cores
    * Socket FM2
    * Integrated Graphics: Radeon HD 7000 series "London" (Est: ~Radeon HD 5670 or better?)
    * Up to DDR3-2133. (Re-use A75 and A55 chipset from A-series.)
    * Replaces A8-35xx, A6-34xx, and A4-33xx series (Llano).

    Performance/Enthusiast (Volan platform)
    * Codename: Vishera
    * Architecture: Piledriver
    * Up to 8 cores
    * Socket AM3+
    * Integrated Graphics: N/A (Discrete CPU)
    * Dual-channel DDR3 memory configuration. (Re-use 9xx series chipset)
    * Replaces FX-81xx, FX-61xx, and FX-41xx series (Zambezi).

    Notebook

    Budget (aka: Value or Essential) and Netbooks (Deccan platform)
    * Codenames: Krishna and Wichita.
    * Architecture: 2nd gen Bobcat (Up to 20% better against Ontario)
    * 1 to 4 core variants.
    * FT2 BGA package. (Soldered on mainboard.)
    * Integrated Graphics: Budget DirectX 11 class GPU (25% better against Ontario); Codenamed "London".
    * DDR3-1600
    * Replaces E- and C-series Fusion APUs
    => 18W TDP: Wichita replaces E-series. (Zacate)
    => 9W TDP: Krishna replaces C-series. (Ontario)

    Tablet (Brazos-T platform)
    * Codename: Hondo
    * Architecture: 1st gen Bobcat (optimised for lower power use.)
    * 2 cores.
    * FT1 BGA package. (Soldered on mainboard.)
    * Integrated Graphics: Re-used from AMD Z-01 APU. Codename: "Loveland"
    * Replaces Z-series Fusion APU
    => Less than 4.5W TDP (Tablets): Hondo replaces Z-series. (AMD Z-01: aka Desna)

    Mainstream and Performance (Comal platform)
    * Codename: Trinity
    * Architecture: Piledriver
    * 2 and 4 core variants.
    * FS1r2 PGA package.
    * Integrated Graphics: Radeon HD 7000 series "London" (Est: ~Radeon HD 5670 or better?)
    * DDR3 (Re-use A70M and A60M chipset from A-series.)
    * Replaces A-series Fusion APUs (Llano).
    => Trinity replaces A8-35xxM/MX series.
    => Weatherford replaces A6-34xxM/MX series.
    => Richland replaces A4-33xxM/MX series.

    Server

    1 to 2 Processor Systems
    * Codename: Sepang
    * Architecture: Piledriver
    * Up to 10 cores
    * Socket C2012
    * PCI-Express 3.0
    * Triple-channel DDR3 memory configuration.
    * Replaces Opteron 4200-series (Valencia).

    2 to 4 Processor Systems
    * Codename: Terramar
    * Architecture: Piledriver
    * Up to 20 cores
    * Socket G2012
    * PCI-Express 3.0
    * Quad-channel DDR3 memory configuration.
    * Replaces Opteron 6200-series (Interlagos).
     
    Last edited: Oct 26, 2011
  3. Dr Evil

    Dr Evil Member

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    All girl's names.

    Be better if it was Lateisha, Fenanay, Latoya & Loquanda
     
  4. Autti

    Autti Member

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    Interesting to see the 2011 Bulldozer server part "Interlagos" has quad channel memory.

    Wonder if consumer could go that way (intel are doing it with x79)
     
  5. stmok

    stmok Member

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    I just realised something that I should have noticed earlier; After waddling through all those codenames...AMD has aligned its products to match Intel's release model!

    2011 => New Architecture => "Tock"
    AMD
    => Bulldozer (32nm) => Zambezi
    => Llano (32nm)
    => Bobcat (40nm) => Zacate, Ontario, and Desna.
    Intel
    => Sandy Bridge (32nm)


    2012 => Revise Architecture => "Tick"
    AMD
    => Enhanced Bulldozer (32nm) => Komodo, and Trinity.
    => Enhanced Bobcat (28nm) => Krishna, Wichita, and Hondo.
    Intel
    => Ivy Bridge (22nm)


    2013 => New Architecture => "Tock"
    AMD
    => Next-Generation Bulldozer (??nm)
    => Next-Generation Bobcat (??nm) => Samara (Tablet Market)
    Intel
    => Haswell (22nm)


    Although, their manufacturing is slightly out of sync for the Bulldozer side. :confused:

    AMD is taking a dual source approach for manufacturing their designs...
    * TSMC => GPUs and Bobcat-based APUs?
    * GlobalFoundries => Bulldozer and mainstream APUs (Llano/Trinity)?
     
    Last edited: Jul 7, 2011
  6. stmok

    stmok Member

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    Just a comment about the slide called Evolving the AMD Compute Platform. (In the first post...17th picture from the top).

    While the slide itself is from a 2008/2009 presentation, it provides a good summary of AMD's long term intentions.

    The following is what I estimate...So take it as a very rough guide OR a [DEL]grain[/DEL] truckload of salt.

    2011: Step 1 Integration
    => APUs: A-series (Llano) and E-/C-/Z-series (Bobcat).

    2012: Step 2 Optimization
    => Trinity APU (Speculation: Closely-coupled GPU cores to 2nd gen Bulldozer?)

    2013+: Step 3 Exploitation
    => ???...A hybrid processor design that incorporates GPU core technology within the 3rd generation Bulldozer based cores. (There is no longer clear GPU and CPU sections.)

    Anything after 2013 is an unknown...
    Mainly because the [DEL]AMD Board fired the very person who came up with this roadmap![/DEL] former CEO, Dirk Meyer, stepped down due to a disagreement in how the tablet market should be handled. :rolleyes: As of this post, they still haven't found anyone to take up the leadership position on a full-time basis. They currently have an interim CEO. (Keeping the seat warm.) ...They're OK until around 2013. :paranoid:
     
  7. sanjeevlives

    sanjeevlives Member

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    lol *mmm hmmmmmm*
     
  8. Autti

    Autti Member

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    Going to intels tick tock strategy is a very good move.
    It will eliminate the problems faced this time round for Bulldozer, that is, a new architecture, and a new process all at the same time.

    Obviously though they won't be able to gain any fabricating advantage, as Intel is still 18 months ahead of everyone else.
     
  9. stmok

    stmok Member

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    From http://www.theinquirer.net/inquirer/news/2079298/amd-believes-intel-nvidia

    AMD's Leslie Sobon (VP of product and platform marketing) is mentioned for saying...

    I guess that's the "Next Generation Bulldozer" (3rd gen)
    => Bulldozer + iGPU (for GPGPU roles) + dGPU (for graphical roles).

    iGPU = integrated.
    dGPU = discrete video card.

    I wonder if the iGPU in the 3rd gen will be based on the newer GPU architecture they've been talking about for their upcoming 28nm GPUs. (VLIW4 + Scalar => Vector + Scalar).
    => http://www.pcper.com/reviews/Graphi...ecture-Overview-Southern-Isle-GPUs-and-Beyond
     
  10. stmok

    stmok Member

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    From Chinese website...
    Original => http://tech.163.com/digi/11/0702/12/77V64ICT00162OUT.html
    Google Translated => http://translate.google.com/transla...digi/11/0702/12/77V64ICT00162OUT.html&act=url

    Someone has been digging around in the preview version of the Catalyst 11.7 driver. There are multiple entries to AMD's future Trinity APU. (Initial basic support for the hardware?)

    What the heck is TRINITY DEVASTATOR DUO? Dual GPU on same die? Crossfire configuration? :confused:

    As well, if you look here...

    [​IMG]

    ...You can see the Radeon HD 64xx series is dead. AMD is raising the bar on GPU performance on the budget end of the market.
     
  11. stmok

    stmok Member

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    Minor update.

    Website DonanımHaber.com has leaked out three slides regarding AMD's path to the tablet market. You can see these in the first post of this thread. (The last three charts).

    2011 => Desna
    2012 => Hondo
    2013 => Samara

    To keep costs low as possible, the 2012 tablet platform (Brazos-T), seems to be nothing more than a more power optimised revision of what they're releasing in 2011.

    Unless its a typo, it looks like the tablet version in 2012 won't be made in 28nm (unlike Krishna and Wichita)...It'll still be 40nm from TSMC.

    The primary motivation is low cost, low power, and mass production to dive into the tablet market...This is to coincide with Windows 8 release.
     
  12. IMtech

    IMtech (Banned or Deleted)

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    I think this is because a HD 6400 class GPU (or better) will be integrated on all upcoming low and mid-range CPUs from 2012 onward, so no point making cards that would be equal to or lower than the integrated GPU me thinks... :thumbup:
     
  13. loophole

    loophole Member

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    Off topic (apologies), but have we heard what Dirk is doing now?
     
  14. vid_ghost

    vid_ghost Member

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    Looking for a job! :paranoid:
     
  15. Mensuri

    Mensuri Member

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    with his - what $17mil payout - i dont think he'd need to do much at all if he didn't want to
     
  16. stmok

    stmok Member

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    From Digitimes...
    => http://www.digitimes.com/news/a20110707PD211.html

    Well, that confirms what is made where...
    * GlobalFoundries is responsible for A-series mainstream APU and FX-series CPU production.
    * TSMC handles Bobcat-based APU and AMD GPU production.

    The former is doing 32nm SOI, while the latter is currently on 40nm and moving to 28nm.
     
  17. Apokalipse

    Apokalipse Member

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    Wasn't GF doing a 28nm bulk process? what will they use it for?
     
  18. stmok

    stmok Member

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    From what I gather...

    GlobalFoundries do their 45nm and 32nm process at Dresden in Germany. That facility is called Fab 1. Fab 1 consists of Modules 1 and 2. They used to be called Fab 36 and 38.
    * Module 1 currently does 45nm and 32nm SOI processors. (Phenom II, Athlon II, Bulldozer, and Llano.)
    * Module 2 is in a transition (200mm wafers to 300mm wafers). They will do 32nm and 28nm bulk in the future.

    The primary site for 28nm bulk production will be at the new facility in New York, USA; called Fab 8. Its currently under construction. It'll produce 300mm wafers.

    Fab 8 will consist of three Modules:
    * Module 1 is scheduled to receive its 28nm production tools this month and will spend approx a year in running through quality checks. The goal is to start production in 2nd half of 2012 and push to full production capacity by 2014.
    * Module 2 and 3 are reserved for future expansion of the whole facility.

    Fab 8 engineers are also working with nearby partners (IBM and Albany Nanotech) for future 20nm and 14nm manufacturing process.

    I have no idea what the 28nm bulk will be used for. :confused:

    GlobalFoundries also have other clients aside from AMD; like Broadcom, Qualcomm, and STMicroelectronics.
     
  19. stmok

    stmok Member

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    Regarding GlobalFoundries fabrication capacities...These slides may help in giving you an overall picture.

    The following are from http://www.inpai.com.cn/doc/hard/149843_4.htm

    [​IMG]

    Fab 36 and Fab 38 are now Fab 1's Module 1 and 2. While NY is now called Fab 8. You can see they are on schedule with Fab 8.

    ...Come to think of it, Fab 8 and their Accelerated Parallel Processing (APP) SDK = OpenCL toolkit for their GPUs; are the only things that seem to be released or running as scheduled. :paranoid:

    [​IMG]

    You might take the above chart with a grain of salt, as its created by a third-party site in Japan and seems a little off compared to the info that's being officially released by GlobalFoundries. Use it as an approx guide to get an idea.

    There is no Fab 4 because of tetraphobia. ie: In Chinese, the pronunciation of 4 is almost the same as Death. (The difference is in tone.)
     
  20. stmok

    stmok Member

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