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2D Stacking vs 3D - The Great Divide

Discussion in 'Overclocking & Hardware' started by ledhead900, Feb 27, 2019.

  1. ledhead900

    ledhead900 Member

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    Sooooo... recently I have been studying and look up information regarding what the next couple gens of processors have in store and came across this -




    Thoughts?
     
  2. Sipheren

    Sipheren Member

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    Watched the other day, it's a pretty cool technique and as the guy says stacking will be the way forward but I think for cost terms and practicality AMD's chiplets on a 2D sub straight will be very good for a few years. Going forward they will both move to 2.5D/3D stacks though.

    It's great seeing Intel put it's massive R&D ability to work though now that they have some competition from AMD and ARM.
     
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  3. OP
    OP
    ledhead900

    ledhead900 Member

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    The technique had been worked on for some time tho without competition spending money to fully switch it into production and market the product was not required, I think both are going to make the cpu's of tomorrow worlds better than what we are doing right now, having said that both INTEL and AMD need to watch out for ARM which is pushing to make its way into desktop competitive business
     
  4. Sipheren

    Sipheren Member

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    Yep, I feel like ARM will be the eventual winner, it looks like Apple will move to it for their laptops and it wont be long before we start seeing viable laptops running Windows 10 ARM. The power to performance is just really good.
     
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  5. mtma

    mtma Member

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    Heat management will be pivotal in the method's success. Covering hot things with hot things goes south relatively quickly, which in the business of cutting edge power RF and radar leads rise to some very sci-fi looking assemblies.

    This is where technological fanciness like on-chip micro-channels that IBM were spruiking some while back might have legs. But then again maybe only for very niche applications for the time being.
     

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