I figured out I better ask twice (to be sorry once) before I start. I have one old DFI LP2 board and it is unstable in the long run (15h of folding and crash)... I noticed how bad the NB chipset contact with cooler on is (almost hole in the middle of the plastic on chipset!) and going to lap it. How far I can go? I read sometimes as far, as I see the cooper? True? (the nF2 chipset has no visible metallic part ATM, DFI NF2 mobo) Even w/o the lapping it can score fairy high O/C, so I wonder how I can take it with the lapp edit: find some pics like in this guide: http://www.techarp.com/showarticle.aspx?artno=70&pgno=0 But looks like they just flatten out the surface? I would like get most of the temperature-resistant PVC out of way, so, what is why I asking how deep can I go. Till the little holes near corner disappear? Till I see cooper?