REVIEW ROG Crosshair VIII Impact X570 - Review and Guide

Discussion in 'Overclocking & Hardware' started by headin2001, Oct 7, 2019.

  1. headin2001

    headin2001 Member

    Apr 17, 2007
    Sunshine Coast
    ROG Crosshair VIII Impact - Review


    Hey Overclockers. Today I am bringing to you something a little different to my normal write-ups. Today I would like to show you the new ROG Crosshair VIII Impact, but also show more about what it's strengths are, and, for those interested, a little guide for how to go to the extreme.

    The C8I, as I will likely call it moving through, is yet another ground up design provided by the engineers at ASUS. Its been a whole 3 years now since we have seen an Impact named motherboard for ASUS, in the form of the Maximus VIII Impact, and now a first for ASUS and an AMD Chipset motherboard.

    Previously, the Impact has always been widely know as an extremely capable memory overclocking board, due to it's tighter in nature mini-ITX form factor and we still continue this trend on the new chipset. This time around though, in order for the engineers to fit all of the VRM components on-board instead of the former daughter board, as well as the AMD X570 Chipset, ASUS have now extended the board and extra 33mm to a mini-DTX form factor. This may mean checking compatibility with your chosen case, but should still fit a variety of small form factor cases.

    What we have is a seriously small, seriously capable motherboard in a perfect balance of engineering bliss and in my opinion, a very good looking package.

    Availability is still in the air currently, as well as pricing but I hope we will have answers on these shortly.

    Enough blabbering, lets get on with the specifications, photos and then the juicy stuff.




    AMD AM4 Socket for 3rd and 2nd Gen AMD Ryzen™/2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors*

    *Refer to for the AMD CPU support list

    Chipset AMD X570


    3rd Gen AMD Ryzen™ Processors

    2 x DIMM, max. 64GB, DDR4 4800+(O.C.)/4600(O.C.)/4533(O.C.)/4400(O.C.)/4266(O.C.)/4133(O.C.)/4000(O.C.)/3866(O.C.)/3733(O.C.)/3600(O.C.)/ 3466(O.C.)/3400(O.C.)/3200/3000/2933/2800/2666/2400/2133 MHz, un-buffered memory

    2nd Gen AMD Ryzen™ Processors

    2 x DIMM, max. 64GB, DDR4 3600(O.C.)/3466(O.C.)/3400(O.C.)/3200(O.C.)/3000(O.C.)/2933/2800/2666/2400/2133 MHz, unbuffered memory

    2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors

    2 x DIMM, max. 64GB, DDR4 3200(O.C.)/3000(O.C.)/2933/2800/2666/2400/2133 MHz, un-buffered memory

    Dual channel memory architecture

    * Double Capacity DRAM support requires specific memory modules.

    * Refer to for the Memory QVL (Qualified Vendors List).

    Expansion Slots

    3rd Gen AMD Ryzen™ Processors
    - 1 x PCIe 4.0 x16 SafeSlot (supports x16)

    2nd Gen AMD Ryzen™ Processors
    - 1 x PCIe 3.0 x16 SafeSlot (supports x16)

    2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors
    - 1 x PCIe 3.0 x16 SafeSlot (supports x8)


    3rd Gen AMD Ryzen™ Processors
    - 1 x M.2 Socket 3 with M Key, type 2242/2260/2280 (PCIe 4.0 x4 and SATA modes) storage devices support

    2nd Gen AMD Ryzen™/2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors
    - 1 x M.2 Socket 3 with M Key, type 2242/2260/2280 (PCIe 3.0 x4 and SATA modes) storage devices support

    AMD X570 chipset
    - 4 x SATA 6Gb/s ports
    - Support Raid 0, 1, 10
    - 1 x M.2 Socket 3 with M Key, type 2242/2260/2280 (PCIe 4.0 x4 and SATA modes) storage devices support


    Intel® Ethernet Controller I211-AT
    Anti-surge LANGuard
    ROG GameFirst Technology

    Wireless Data Network

    Intel® Wi-Fi 6 AX200

    2 x 2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax) with MU-MIMO supports dual frequency band 2.4/5GHz
    Supports channel bandwidth: HT20/HT40/HT80/HT160

    Up to 2.4Gbps transfer speed

    Bluetooth Bluetooth v5.0


    ROG SupremeFX 8-Channel High Definition Audio CODEC S1220
    - Supports up to 32-Bit/192kHz playback*
    - High quality 120 dB SNR stereo playback output and 113 dB SNR recording input
    - Impedance sense for front and rear headphone outputs
    - ESS®

    ES9023P High Definition DAC
    - SupremeFX Shielding Technology
    - Jack-detection, Multi-streaming, and Front Panel Jack-retasking
    - Optical S/PDIF out port at back Panel

    Audio Features:
    - Sonic Radar III
    - Sonic Studio III + Sonic Studio Virtual Mixer

    - DTS®
    Sound Unbound

    *Due to limitations in HDA bandwidth, 32-Bit/192kHz is not supported for 8-Channel audio.


    3rd Gen AMD Ryzen™ Processors.

    - 2 x USB 3.2 Gen 2 ports (2 ports at back panel, Type-A [red])
    - 2 x USB 3.2 Gen 1 ports (2 ports at back panel, Type-A [blue])

    2nd Gen AMD Ryzen™/2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors.

    - 4 x USB 3.2 Gen 1 ports (4 ports at back panel, Type-A)

    AMD X570 chipset:
    - 1 x USB 3.2 Gen 2 front panel connector
    - 4 x USB 3.2 Gen 2 ports (4 ports at back panel, 3 x Type-A [red], 1 x Type-C)
    - 2 x USB 3.2 Gen 1 ports (2 ports at front panel)
    - 2 x USB 2.0 ports at front panel

    ROG Exclusive Features

    Extreme Engine Digi+
    - MicroFine Alloy Choke
    - TDA21472 Power Stages
    - 10K Black Metallic Capacitors

    ROG Extreme OC kit :

    - Safe Boot button
    - Slow Mode
    - LN2 Mode
    - OptiMem III

    Extreme Tweaker

    ROG Exclusive Software

    - RAMCache III
    - ROG RAMDisk
    - CPU-Z
    - GameFirst V
    - Sonic Studio III + Sonic Studio Virtual Mixer
    - Sonic Radar III

    Special Features

    ASUS Exclusive Software Features

    - Armoury Crate
    - AURA
    - ASUS Dual Intelligent Processors 5
    - 5-way Optimization tuning key perfectly consolidates TPU, EPU, DIGI+ VRM, Fan Expert 4, and Turbo App
    - AI Suite 3
    - ASUS CrashFree BIOS 3
    - ASUS EZ Flash 3
    - ASUS C.P.R. (CPU Parameter Recall)
    - Ai Charger

    ASUS Exclusive Hardware Features

    - ROG patented pre-mounted I/O shield
    - ASUS NODE: hardware control interface
    - USB BIOS Flashback™ Button
    - Clear CMOS Button
    - Start Button
    - Reset Button
    - ReTry button

    ASUS Q-Design

    - Q-Code
    - Q-Slot
    - Q-LED
    - Q-DIMM

    Back I/O Ports

    1 x Clear CMOS button
    1 x BIOS Flashback™ button
    1 x Q-Code
    1 x Reset button
    1 x 2x2 Wi-Fi Module
    6 x USB 3.2 Gen 2 ports (1 x Type-C and 5 x Type-A [red] )
    2 x USB 3.2 Gen 1 ports [blue]
    1 x Anti-surge LAN (RJ45) port
    1 x Optical S/PDIF out
    3 x LED-illuminated audio jacks

    Internal connectors

    1 x USB 3.2 Gen 2 front panel connector
    1 x USB 3.2 Gen 1 header supports additional 2 USB 3.2 Gen1 ports
    1 x USB 2.0 headers support additional 2 USB 2.0 ports
    1 x NODE connector
    4 x SATA 6Gb/s connectors
    2 x M.2 Socket 3 for M Key, type 2242/2260/2280 storage devices support
    1 x 4-Pin CPU_Fan connector
    1 x 4-Pin CHA_Fan connectors
    1 x 4-Pin W_PUMP+ connector
    2 x 4-Pin RAD_FAN connector
    1 x 3-Pin W_FLOW connector
    1 x 2-Pin W_IN connector
    1 x 2-Pin W_OUT connector
    1 x T_SENSOR connector
    1 x 24-pin EATX power connector
    1 x 8-pin EATX 12V power connector
    1 x Start button
    1 x Safe Boot button
    1 x Retry button
    1 x LN2 mode jumper
    1 x Slow mode switch
    1 x System panel connector
    1 x Front panel audio connector (AAFP)*
    2 x Aura Addressable Gen2 headers
    1 x Aura RGB headers
    *AAFP connector is built-in on the SupremeFX Impact IV audio card.


    1 x User guide
    1 x Support DVD
    1 x ASUS 2x2 dual band Wi-Fi antenna
    2 x 2-in-1 SATA 6Gb/s Cables
    1 x Extension Cable for RGB strips
    1 x Extension Cable for RGB Addressable strips
    1 x ROG Coaster
    1 x ROG sticker
    1 x Panel Cable
    1 x ROG thank you card
    1 x Cablemod coupon

    ROG SO-DIMM.2 with heatsink:

    1 x ROG SO-DIMM.2 with heatsink
    2 x M.2 screws package
    1 x 2-in-1 Rubber pad


    256 Mb Flash ROM, UEFI AMI BIOS, PnP, WfM2.0, SM BIOS 3.2, ACPI 6.2 Manageability WOL, PXE


    Anti-virus software (1-year full subscription)

    Operating System

    Windows® 10 64-bit

    Form Factor

    Mini-DTX Form Factor - 8.0 inch x 6.7 inch (20.3cm x 17cm)


    Product (mm)_ L*W*H - 203mm*170mm*45mm
    Color Box (mm)_ L*W*H - 268mm*264mm*82mm
    Weight Motherboard only - 0.85 kg
    Full package - 1.85 kg
    Last edited: Oct 7, 2019
    juzz86 and Agg like this.
  2. OP

    headin2001 Member

    Apr 17, 2007
    Sunshine Coast
    Photos / Info

    The ROG Crosshair VIII Impact come in the usual branded packaging we are accustomed to in recent times. Red and black are still heavily featured, with the Republic of Gamers logo's all round. The overall packaging measuring 268mm*264mm*82mm in total.


    Opening the box up, we can reveal the beautiful little board in all it's tiny glory. (note, shamelessly added G.Skill TridentZ memory and So-DIMM.2 as I couldn't contain my excitement).


    Getting deeper into the package, we can reveal all of the accessories that are included. We get all the usual stickers, coaster, manual, Driver/software DVD, m.2 screws, WiFi antenna, So-DIMM.2 card, 4xSATA cables, an RGB Extension Cable and also an addressable RGB extension cable.



    The 2x2 Dual-band WiFi antenna is a similar design to that found in the Maximus XI Gene. The cable is an adequate length to suit most situations and features gold connectors. The WiFi utilises Intel's WiFi 6 AX200 adaptor which is capable of transfer rates up to 2.4Gbps, plus also covers Bluetooth via the same interface.


    One of my favourite inclusions is the front panel header cable. This tricky bit of wire is handy for connecting your case power switches and HDD leads in a simple plug without seeing them all once installed in your case of choice. A small detail, but to me a super handy one.


    Lets check out the motherboard now. The main features to point out are the 2 DIMM slots located as close to the CPU socket as possible, which aids in making this motherboard a dream for memory tweakers. There is 2 centrally located fan headers, which is all honesty are tricky to access once a cooler and GPU are mounted, so keep this in mind when installing. The 8pin and 24pin power connectors are located on the same edge, which will allow for simpler cable management in the small confines of the cases this is intended to inhabit. Other quick features are the large dual fan cooled IO/VRM heatsink, SO-DIMM.2 slot, single Gen4 PCIe slot and SupremeFX soundcard. CPU Cooler spacing is AM4 only on this platform, so check your cooler compatibility.


    On the back side, we find a fairly durable backplate now included. ASUS have added this to the board to aid in cooling the VRM area. We are all aware of the extra heat now released by the X570 chipset due to the inclusion of Gen 4.0 PCIe, so every small inclusion to aid in cooling is a plus. ASUS have gone that step ahead by adding a heatpipe and thermal pads to help disperse the heat as efficiently as possible. As much as I find the logo on the backplate appealing, I always fail to understand it as it is rarely seen once mounted in a case.



    Rear IO connectors include 5 x USB 3.2 Gen 2 ports Type-A [Red ports]), 2 x USB 3.2 Gen 1 ports Type-A [Blue Ports], Optical Audio connector, RJ45 LAN port, 1 x USB 3.2 Gen 2 ports Type-C, Wi-Fi/Bluetooth jacks, Reset button, Q-Code LED, Clear CMOS button, USB Bios Flashback Button, and LED lit Audio I/O ports.


    As mentioned before, beside the DIMM slots, we find the 8pin and 24pin power connectors, Start button, front USB3.2 Gen1 header, front USB3.2 Gen2 header and 2x SATA 6Gb/s connectors.


    Further down, we have 2 x 90deg SATA 6Gb/s connectors, Retry and Safe boot switches, the system panel connectors, front panel USB2.0 connector, LN2 mode jumper, Slow Mode switch, addressable Gen2 RGB connector, water temp in/out, water flow and water pump headers. In the middle is also a new connector for what ASUS have called the NODE connector for future bi-directional communications to front panel telemetry or other third party products.


    The last included accessory is the SO-DIMM.2 card. The SO-DIMM.2 utilises an on-board, you guessed it, So-DIMM slot to enable the use of 2x M.2 SATA or NVMe drives. One lane connected to the CPU PCIe lanes, the other to the Chipset. The riser card obviously required due to the reduced real-estate available on the smaller mini-DTX form factor.




    Also included is RGB lighting to the top edge Republic of Gamers wording.


    Under the heatsinks of the SO-DIMM.2, we see the M.2 Connectors allowing the fitment of type 2242/2260/2280 storage devices, as well as 2 additional Fan headers, and a Gen 2 addressable RGB header. While speaking of headers, all on-board fan headers are designed for upto 1A/12W max power draw, with the water pump header allowing up to 3A/36W draw.




    The ROG Crosshair VIII Impact now features an updated SupremeFX soundcard, located at the bottom edge of the motherboard. It features a brushed alum cover plate, SupremeFX S1220 codec, Premium Nichicon capacitors to ensure low ripple and noise and a MOSFET switching circuit lifts the audio output to prevent “DC thump”. The majority of the components are on yet again another addin board, with the main motherboard itself featuring the same PCB sound isolation found on other ROG products.





    Lets get this baby NAKED (warning NSFW)

    Stripping the covers off, we can now see the motherboard in all it's glory.



    The backside we can see the remainder of the power delivery to the right, which is cooled by the backplate heatpipe I mentioned earlier.



    Here we have the AMD X570 chipset, which is a bare die design that is actively cooled along with the VRM.


    Feel the Power

    The VRM heatsink is actively cooled via 2 x 40mm fans. These are controllable via bios to give the user the ability to add extra cooling where necessary, or reduce the speed to for noise. On the noise front, I am going to be honest here and say, if you can hear these running, you need to get out more, as they are dead set super quiet.


    Removing the heatsink grill via the 2 small screws, we can now see the 2x 40mm fans for actively cooling the VRM area.



    The heatsink is a combination of solid aluminum and some soldered finned sinks under the fans to increase the surface area. Thermal pads are used liberally to the VRM mosfets, as well as the chipset. A step up from the previous solid heatsinks of the past, but I would love to start seeing some proper heatpipe coolers from years ago.



    Asus still employ their own coded Digi+EPU PWM controller. Details are hard to find, but it is certainly able to control the eight TDA21472 power stages teamed across four phases. That's correct, 8 power stages over 4 phases, not 8 phases. ASUS favouring this topology for its ability to rapidly dispatch current when high core count CPUs are transitioning between load states.



    That's about all I have for this section. There is seriously a lot going on in such a small footprint here, it can be hard to capture it all. If anyone has any requests on other areas of interest, please comment below and I will endeavour to capture while I still hold the sample.
    Last edited: Oct 7, 2019
    juzz86 likes this.
  3. OP

    headin2001 Member

    Apr 17, 2007
    Sunshine Coast
    OC Guide coming soon

    Memory Testing

    Sharing some results based on different memory module here.

    G.Skill TridentZ 2x16gb 3200C15
    Double Sided Samsung B-Die - 1.45v Bios



    3600C14-14-14-1T - 1.44v Bios


    Pushing further, 4000C14-14-14-1T Tight is possible with 1.8v bios, 1900FCLK. The Impact handles these like an absolute champion.


    G.Skill TridentZ 2x8Gb 4400C19
    Single sided Samsung B-Die - A0 type PCB

    The 3800mem/1900 FCLK range is where latency and performance hit their maximum.
    Below is as tight as my sticks can possible go. Latency down to 61.1ns, GB3 multicore mem score is as high as a good Intel 9900K settings.

    3800C12-11-10-10-1T - 2.01v VDIMM Bios


    Last edited: Oct 8, 2019
    juzz86 likes this.
  4. OP

    headin2001 Member

    Apr 17, 2007
    Sunshine Coast
    LN2 guide

    Ok guys, this is where we get serious. On such a small board, preparation is everything. These boards get wet very easily, so the more time set getting ready first, the longer and safer your session is going to be.

    If you are looking to go cold on these there is a few things to keep in mind, and I will aim to make this as simple as possible to get you off and running.

    This guide can also be used for most X370/X470/X570 boards when utilising the Zen2 architecture chips (of the 3000 series).

    The Cold Bug

    As with most CPUs, the 3xxx CPU's all generally have a coldbug. For the LN2 uninitiated, this is a point in temperature where the CPU can no longer function. This isn't a usual one like we saw back in the days of Haswell due to the Integrated VR, or older generations that just refuse to function past a point due to the extreme cold.

    On Zen and Zen+ there was no Cold bug, so in XOC terms we could run what we call Full Pot, which is when our LN2 is full of Liquid Nitrogen at a temperature in the vacinity of -192c.

    Zen2 the experience a different , it is due to the FCLK setting for the internal fabric. What this means, is that at certain FCLK settings, we can tune down in order to raise our coldbug. Some samples, there is just no work around, and the CB will be exhibited regardless of the FCLK setting, where others will be able to run Full Pot depending on the board and settings.

    On my 3900X sample on the C6H, I experienced the following cold bugs.
    No CB @ 1467 FCLK
    -180 @ 1500 FCLK
    -150 @ 1600 FCLK
    -120 @ 1733 FCLK

    As we can see, depending on the pot temperature, we can tune out the cold bug by adjusting the FCLK settings. On X570, this can be slightly different. For some CPU's and Motherboard combinations though, the Coldbug will be evident from -140 to -180. When this is the case, it's just a matter of working with the highest FLCK setting you can with the lowest CB temperature possible for the best results.

    On the ROG Crosshair VIII Impact, I suggest using either 0044 bios (for Bios recovery), or 0045 for no bios recovery and infinite ReTry. Bios 1001 had coldbug issues for me at -175, so would suggest not using this bios for XOC. You can find files on hwbot (thanks to Safedisk for the info).

    Memory Training Bug.

    Zen2 exhibits what I would like to call a training bug. Why I call it this, is that on restarts if you are colder than around -40c, your board will fail to boot as it cannot train the memory. This will show as a 8C code, so get warmer than that temp and you will hopefully boot again.

    What I suggest is making sure you have a good profile saved with your memory settings, and a good set of voltages set ready to go. That way when you are in the thick of it, and need a CMOS reset, you can warm up to -30 to -40, reset the bios, and start again.

    This one is a real pain, as it falls in a very tricky temperature zone for those wanting to use Dry Ice. In my early testing, I was attempting to use my single stage cooler, but has endless pain on booting due to it being in the -55 to -60 zone. Not something I would suggest to anyone to try.

    Debug Codes

    Our pet hates, but also our friends for working out what went wrong.

    22 - Failed boot, usually using retry button or turning off then on will bring bios failure notice up.
    F9 - Training failure. Sometimes retry will result in booting. Alternatively a timing too tight.
    63, 01 - Memory train failure. Usually a timing incorrect.

    Sometimes there is just a loop you cannot get out of. Pulling the power can help clear to get back into bios, but generally a CMOS reset is usually required when this happens.

    Preparation and Equipment

    Before you begin, as always the first step is to setup some profiles on air to make sure everything is working as efficiently as possible. Due to the FCLK nature on this platform, I setup some profiles utilising a high 4600C14-13-1T memory setting with a lower 1200 FCLK setting, as well as a 2933C9 setting using a 1467 FCLK. This way I could run easily the best settings I need for certain benchmarks.

    As mentioned earlier, prepping is key between a good session and a total failure. For my cold benching, I use the following

    CPU pot - Kingpin T-REX
    Thermal Paste - Kingpin KPx, Thermal Grizzly Kryonaut or Gelid Extreme
    Backplate heater - Kingpin Inferno
    Liberal amounts of Blue Shop Towel, I use Scotts
    A good MAP gas torch
    Lots of Flasks
    Dewar full of the very cold stuff

    You don't have to use these, as there is plenty of other products fairly available from BartX, Der8auer and used in forums around the world. Do note though, not all are made to suit the AM4 hold-down pattern, but it is possible to use them slightly skewed with only 2 hold down rods/nuts.

    I personally suggest grabbing an Inferno Backplate heater though, as it eliminated 99% of the need for Vaseline or PlastiDip, though depending on the humidity of your area, the extra measure will be totally worth it.

    As the heatsink is necessary for the chipset on these, I suggest working around the area with some paper towel incase the heatsink gets cold from the CPU and moisture forms. I have learnt you can never have too much towel.


    Once prepped, and ready to go, do a quick test at ambient temp just to be sure that everything is functioning, memory is all working correctly and you are set to go.

    Into the Cold we go!

    On the X570 Crosshair series of boards, enable the LN2 jumper to remove the voltage limitations and enable the CB work around voltages. This doesn't apply voltages we are normally used to on boards that increase the heat immensely to begin with, and will be OK for short periods at ambient temperature (just remember to switch the jumper back when you are done).

    Voltages to set:
    Vcore - Chips scale to around 1.8v, on single core benchmarks upto 1.9v is still ok.
    CLDO VDDG - 1.15v, this aids the FCLK coldbug. Up to 1.2v is possible on some samples. This voltage must be lower than the SOC Voltage
    SOC Voltage - 1.3 to 1.45v is safe on Cold. Chip dependent for the limit, too much can cause as many problems as too little. For my chip 1.35v was ample.
    Core ratio - stick to around 4ghz remembering you are booting high vCore at warmer than -40c
    LoadLine - I set to 4. Make sure you increase all power limit settings.

    For best performance, a 1:1 memory/FCLK ratio is preferred. So settings from 2800-3200 memory set FCLK to half the memory speed. Alternatively, memory of 4400+, setting the FCLK as high as your coldbug will allow is possible, but a performance penalty will be incurred due to the increased latency of the fabric.

    Pour down once set, and find where the cold bugs exist, and off you go. Have fun, and remember on any reboots, there is a massive chance you will have to torch to -40 to boot again.


    Some screens from my C6H session, I will rerun on my next LN2 fill on the C8I :

    #1 AMD 32m SuperPi





    Last edited: Oct 7, 2019
    Raptor_Eye, juzz86 and mad_mic3 like this.
  5. terrastrife

    terrastrife Member

    Jun 2, 2006
    ADL/SA The Monopoly State
    eyo has it listed for $745 eta 2 weeks, oof.
  6. OP

    headin2001 Member

    Apr 17, 2007
    Sunshine Coast
    Double sided B-Die memory results added. More to come.
    mad_mic3 and terrastrife like this.
  7. shane41

    shane41 Member

    Nov 10, 2008
    dice que no sabe
    Nice effort man. I'll give it a read tonight.
  8. mad_mic3

    mad_mic3 Member

    Jan 18, 2009
    another sweet review:thumbup::thumbup:
  9. dasa2

    dasa2 Member

    Feb 5, 2003
    Northern VIC
    Looking forward to seeing how it can perform with ~4800 memory tuned.
  10. OP

    headin2001 Member

    Apr 17, 2007
    Sunshine Coast
    Thanks guys. I wanted to run this one different to the usual reviews. Figured pitting one modern motherboard against another these days is pointless as they all result around the same anyway.

    I have some 4733C14-13-1T results to tickle your fancy coming dasa2 , it is fast, but I will see what my new sticks today will bring first ;)
  11. cbjaust

    cbjaust Member

    Sep 11, 2003
    headin2001 likes this.
  12. nosunline

    nosunline New Member

    Oct 9, 2019
    This is a sick writeup! So much work going into this
  13. DarkSnipa

    DarkSnipa Member

    May 13, 2017
    Would be awesome to see how the Samsung bdie and Micron E die performs on this board without super binned CPUs, this is definitely on my list to buy if it can help me to push memory over 5000MHz :p
  14. juzz86

    juzz86 Member

    Nov 15, 2013
    Forth, NW TAS
    You do not fuck around on the gear my friend. Awesome write-up, loved the detail on the cold bugs and training stuff. Cheers! :thumbup:

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